We list our usual material and technical specification of Flexible Circuits & flex printed circuits (FPC) in the below table. Also, you can view the facility tolerance of circuits.
If you would like some special raw material for Flex Circuits, tighter tolerance or other requirements of flexible PCB (flex circuit board), you can Contact our staff directly, we are at your service at any time.
List of Flexible Circuit Manufacturing Capacity
Parameter (mm) |
Polyimide (PI) |
PET |
|
Laminate Thickness | 0.025 / 0.050/ 0.125/ 0.175 | 0.025 / 0.050/ 0.075 | |
Copper Foil | 0.012,0.018,0.035,0.070 | 0.035,0.070 | |
Min Pattern width/Space | 0.075(3 mil) | 0.075(3 mil) | |
Min. Drilled Hole Size | Non-Plated Thru | 0.25+/-0.05mm | |
Plated Thru |
0.1mm+/-0.075mm |
||
Outlines Dimension | +/- 0.05mm | +/- 0.05mm | |
Peeling Strength(180°Direction) |
>1.2kgf / cm | >1.2kgf / cm | |
Solder Hent Resistance | 280℃ / 10secs | 280℃ / 10secs | |
Surface Treatment | Ni/Au | 2~5μm | 2~5μm |
Au(Electro/Immersion) | 0.03 ~0.1μm | 0.03 ~0.1μm | |
Sn/Pb (Lead Free) | 3~ 20μm | 3~ 20μm | |
Sn-Cu Plating (Lead Free) | 3~ 5μm | 3~ 5μm | |
Tin Plating (Pure Sn) | 5 ~ 8μm | 5 ~ 8μm | |
Bending flexibility | Meet to IPC Criterion | ||
Chemical Resistance | Meet to IPC Criterion |