Flexible circuits and flex printed circuits (FPC) are made from a wide range of materials. The most widely used Flexible Circuits & flex printed circuits (FPC) material today is Polyimide (PI), which is manufactured by Dupont Corporation and is called "Kapton". Polyimide exhibits an exceptional combination of thermal stability (>500°C), mechanical toughness, and chemical resistance. They have excellent dielectric properties and inherently low coefficient of thermal expansion.
The thickness of flexible circuits varies depending on the application. For example, thinner flexible circuits are often used in medical devices, while thicker ones are more suitable for industrial control systems or automotive applications because they have greater tensile strength and can withstand higher temperatures without warping or cracking.
When it comes to the thickness of FPC, the stiffener about should be mentioned. Stiffener are used to harden a certain of part of rigid to make flexible circuit is easier to solder connectors or SMD components to the stiffer part. It can be said, stiffener is an integral part in FPC, so choose a suitable stiffener for your project is important.
The following table lists our usual material and basic technical specification of flexible circuits and flex printed circuits (FPC). If you would like some special raw material for Flex Circuits, tighter tolerance or other requirements of flexible PCB (flex circuit board), you can contact our sales directly, we are at your service at any time.
If you would like some special raw material for Flex Circuits, tighter tolerance or other requirements of flexible PCB (flex circuit board), you can Contact our staff directly, we are at your service at any time.
List of Flexible Circuit Manufacturing Capacity
|Laminate Thickness||0.025 / 0.050/ 0.125/ 0.175||0.025 / 0.050/ 0.075|
|Min Pattern width/Space||0.075(3 mil)||0.075(3 mil)|
|Min. Drilled Hole Size||Non-Plated Thru||0.25+/-0.05mm|
|Outlines Dimension||+/- 0.05mm||+/- 0.05mm|
|>1.2kgf / cm||>1.2kgf / cm|
|Solder Hent Resistance||280℃ / 10secs||280℃ / 10secs|
|Au(Electro/Immersion)||0.03 ~0.1μm||0.03 ~0.1μm|
|Sn/Pb (Lead Free)||3~ 20μm||3~ 20μm|
|Sn-Cu Plating (Lead Free)||3~ 5μm||3~ 5μm|
|Tin Plating (Pure Sn)||5 ~ 8μm||5 ~ 8μm|
|Bending flexibility||Meet to IPC Criterion|
|Chemical Resistance||Meet to IPC Criterion|
|Stiffener Material||Usual Thickness|
|Polyimide (PI)||0.075mm, 0.1mm, 0.125mm, 0.15mm ,0.175mm, 0.2mm , 0.225mm, 0.25mm|
|FR4||0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm~1.6mm|
|Stainless Steel||0.1mm, 0.2mm|
|Aluminum||1.0mm, 2.0mm (rarely used)|