2022-11-11 BEST

Flexible Circuit Production Capability

We list our usual material and technical specification of Flexible Circuits & flex printed circuits (FPC) in the below table. Also, you can view the facility tolerance of circuits.

Flexible circuits and flex printed circuits (FPC) are made from a wide range of materials. The most widely used Flexible Circuits & flex printed circuits (FPC) material today is Polyimide (PI), which is manufactured by Dupont Corporation and is called "Kapton". Polyimide exhibits an exceptional combination of thermal stability (>500°C), mechanical toughness, and chemical resistance. They have excellent dielectric properties and inherently low coefficient of thermal expansion.

The thickness of flexible circuits varies depending on the application. For example, thinner flexible circuits are often used in medical devices, while thicker ones are more suitable for industrial control systems or automotive applications because they have greater tensile strength and can withstand higher temperatures without warping or cracking.

When it comes to the thickness of FPC, the stiffener about should be mentioned. Stiffener are used to harden a certain of part of rigid to make flexible circuit is easier to solder connectors or SMD components to the stiffer part. It can be said, stiffener is an integral part in FPC, so choose a suitable stiffener for your project is important.

The following table lists our usual material and basic technical specification of flexible circuits and flex printed circuits (FPC). If you would like some special raw material for Flex Circuits, tighter tolerance or other requirements of flexible PCB (flex circuit board), you can contact our sales directly, we are at your service at any time.

If you would like some special raw material for Flex Circuits, tighter tolerance or other requirements of flexible PCB (flex circuit board), you can Contact our staff directly, we are at your service at any time.

List of Flexible Circuit Manufacturing Capacity

Parameter (mm)

Polyimide (PI)


Laminate Thickness 0.025 / 0.050/ 0.125/ 0.175 0.025 / 0.050/ 0.075
Copper Foil 0.012,0.018,0.035,0.070 0.035,0.070
Min Pattern width/Space 0.075(3 mil) 0.075(3 mil)
Min. Drilled Hole Size Non-Plated Thru 0.25+/-0.05mm
Plated Thru


Outlines Dimension +/- 0.05mm +/- 0.05mm

Peeling Strength(180°Direction)

>1.2kgf / cm >1.2kgf / cm
Solder Hent Resistance 280℃ / 10secs 280℃ / 10secs
Surface Treatment Ni/Au 2~5μm 2~5μm
Au(Electro/Immersion) 0.03 ~0.1μm 0.03 ~0.1μm
Sn/Pb (Lead Free) 3~ 20μm 3~ 20μm
Sn-Cu Plating (Lead Free) 3~ 5μm 3~ 5μm
Tin Plating (Pure Sn) 5 ~ 8μm 5 ~ 8μm
Bending flexibility Meet to IPC Criterion
Chemical Resistance Meet to IPC Criterion


Stiffener Material Usual Thickness
Polyimide (PI) 0.075mm, 0.1mm, 0.125mm, 0.15mm ,0.175mm, 0.2mm , 0.225mm, 0.25mm
FR4 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm~1.6mm
Stainless Steel 0.1mm, 0.2mm
Aluminum 1.0mm, 2.0mm (rarely used)