1. A method of manufacturing an integrated circuit package comprising the steps of:
A. providing a flexible substrate with electrical connections for chips and having end portions;
B. providing a plurality of chips having a back;
C. connecting said plurality of chips to the electrical connections located on said flexible substrate;
D. folding said flexible substrate in such a manner that said chips have their backs located adjacent to the back of another chip and end portions are located within or surrounded by other portions of said flexible substrate; and
E. connecting the backs of said adjacently located chips together to form a combined flexible substrate and chips assembly.