Which kind of FPC can be replaced by FFC?

FFC (flexible flat cables) are a type of ribbon cable, so named due to their wide flat structure. They are usually a straight connector, without any additional components. The lines are straight and the spacing is fixed.

Standard FFC BFS17386-B

FPC is made of polyimide material and etched copper conductors. FPC can accept more severe tolerance than FFC and is also available in 0.3mm thick versions. There are many different kinds of FPC, including single layer, double-sided, multilayer flex circuits.

Standard Fpc BFD21076

The cost of FFC will be much lower than FFC, and the flexibility and connectivity are almost same. Normally the FFC are used in plug connectors, there are golden fingers on both side, golden finers can be in different directions; all traces are straight and the spacing is fixed, like below picture. If your FPC project is similar to this design, no component needed, then you can design it as a FFC.

FPC with EMI shield BFD17016

The black film on above FPC, it’s EMI shield, if you want FFC to have a shielding effect as well, we can add the aluminum foil on FFC, like below picture.

FFC with aluminum foil BFS20233

If you have similar design or want to know more details about flexible flat cables, please feel free to contact us at sales@bestfpc.com

How to choose the FPC stiffener?

 Flexible PCB -Flexible Printed Circuits are made of thin dielectric substrate & high ductility metal foil, flexible pcb can be bent or folded and used in static and dynamic applications. 

Do you know why the fpc need to add the stiffener?

Flexible-only PCBs can withstand fewer components than rigid-flex. The rigid part of rigid-flex can also be as complex as a traditional rigid Circuit Board. Stiffeners are occasionally laminated the same time as the coverlay.

When we need to add the Stiffeners ?

Components are near or in an active, or dynamic, flex zone
Component size and weight will import stress onto the flex
A large number of SMT pads make planarity critical
Connectors that require repeated insertions or assemblies require a stiffener, or something to help alleviate the stress of pads.

When we don’t suggest to to add the Stiffeners ?

 Small “static” components do not exert a large amount of strain on the flexible of the PCB.There are no components in the flex region.

How to choose the FPC stiffener?
 As we all know, the Stiffeners are typically made of FR4, PI(Kapton), stainless and alumimum stiffener.Then how we we too choose the right stiffener?

PI is often used when the end of the flex must be thickened and inserted into a ZIF connector. However, the use of Kapton(PI) requires a separate lamination cycle. For golden area, we will be need to add the PI stiffener to meet the total thickness 0.2mm, 0.3mm or 0.5mm.   

PI stiffener

FR4 stiffener can be done within the same lamination cycle. FR4 stiffener usually added for the USB connector area.

FR4 stiffener1

Stainless stiffener is not easy to transformation. And it has the good hardness. And it can play a conductive and inductive role.

Stainless stiffener

Aluminum stiffener has the best heat disspation effect, because it usually need to openning a tooling to cut the alumunum stiffener outline, then the cost is the highest.

Alumininum stiffener

Are you got it? If you have any comments, please kindly feel free to let me know. Please contact Best Technology at sales@bestfpc.com.

What’s the difference between PI base material, PI coverlay, and PI stiffener?

As a special engineering material, PI has been widely used in aviation, aerospace, microelectronics, nano, liquid crystal, separation membrane, laser and other fields.It has flame retardant, high temperature resistance and low temperature resistance at the same time, long-term use temperature in -200℃~426℃.

Polyimide(PI) is very common in Flexible Board, it exist in base material, coverlay, even stiffener. Maybe some people feel confused about it, so today let discuss what’s the difference between them?

The difference in function:

  1. PI base material: For FPC base material, it have two types, adhesive base material or adhesivelesss base material. No matter for adhesive base material, or adhesivelesss base material, Polyimide(PI) is essential.
  2. PI coverlay: Its main function is used for circuit insulation.
  3. PI stiffener: Often applied to the area on the back of the FPC goldfinger. The PI stiffener is used to increase the thickness and hardness of the finger, which is easy to insert and remove.

The difference in thickness:

  1. PI base material: For the PI in base material, 1/2mil, 1mil are very common, its thickness even can arrive 4mil, 5mil(Dupont adhesivelesss PI material).
  2. PI coverlay: On coverlay, the PI thickness have two choice, 1/2mil or 1mil.
  3. PI stiffener: For PI stiffener, the thickness have many option according to customer’s need, such as 0.075mm, 0.1mm, 0.125mm, 0.15mm, 0.175mm, 0.2mm, 0.225mm, 0.25mm.

The difference in color choice:

  1. PI base material: No choice for option.
  2. PI coverlay: PI coverlay have three color, yellow, white and black.
  3. PI stiffener: It will change with the thickness change. The thicker it is, the darker it is. For example, 0.075mm PI stiffener looks like brown, 0.25mm PI stiffener more close to dark.

Wish above information is helpful for you. If you have any question, pls feel free to contact us.

What is the difference between FPC coverlay and EMI shield?

Covering is the film that covers and presses on the surface of the flexible circuit, usually polyimide resin, used for solder mask, etc., and has little effect on signal shielding. The Electro-Magnetic Interference (EMI) shield is generally attached to the coverlay, and the price of the EMI shield is much more expensive than the coverlay. What is the difference between FPC coverlay and EMI shield?

FPC coverlay, known as CVL in the industry, it has the same main function as the solder mask of PCB: 1) Protect the copper foil from being exposed to the air and avoid oxidation of the copper foil; 2) Cover for the areas which it do not need to do surface treatment. 3) The solder resist function in the SMT. The usual colors are yellow, black and white in Best Tech.

FPC with yellow coverlay

The EMI shield uses mixed composite metal as the shielding material and has excellent OSP performance and corrosion solvent resistance. It is superior to similar products in the market in shielding and winding characteristics. The EMI shield is suitable for flexible printed circuits. It has high shielding, bending and heat resistance. The usual color is black in Best Technology.

EMI material

After pressing the cpverlay, the FPC will press a layer of EMI shield as a conductive layer to shield the external electromagnetic interference. EMI shield is mainly used in 3C products such as notebook computers, GPS, ADSL and mobile phones, because they all produce noise due to high-frequency electromagnetic interference, which affects the quality of communication.

FPC with EMI shield
Rigid-flex with EMI shield

If you want to know more design guild about the EMI shield, please feel free to contact us at sales@bestfpc.com

Why the FPC can not use HASL surface treatment?

The hot air solder leveling is a technology developed for the coating of lead-tin on rigid printed circuit boards. Due to the simplicity of this technology, it is also applied to flexible printed board FPC. But we usually don’t suggest to use HASL and suggest to use ENIG.

In modern market, there are no FPC manufacturer will be use HASL surface to instead of ENIG. Although ENIG will be expensive than HASL. Attached the ENIG FPC and HASL FR4 PCB pictures for your reference, please kindly check it.


The hot air leveling is to immerse the board directly in the molten lead-slot, and the excess solder is blown off by hot air. This condition is very demanding for the flexible printed board FPC. If the flexible printed board FPC cannot be immersed in the solder without any measures, the flexible printed board FPC must be clamped to the middle of the screen made of titanium steel. Then, it is immersed in the molten solder. Of course, the surface of the flexible printed board FPC is also cleaned and coated with flux.

Due to the harsh hot air leveling process conditions, it is easy for the solder to be drilled from the end of the cover layer to the underside of the cover layer, especially when the bond strength between the cover layer and the copper foil surface is low, and this phenomenon is more likely to occur frequently. Since the polyimide film is easy to absorb moisture, when the hot air leveling process is used, the moisture absorbing moisture will cause foaming or even peeling of the cover layer due to rapid heat evaporation, so it is necessary to dry and prevent moisture before the FPC hot air leveling management.

As we all know, the Gold is a better finish for the corrosive environment if it is clean going into the field. HASL will typically use a very corrosive flux to prepare the surface and if this is a lead free HASL or leaded it does not matter, both are susceptible to corrosion.

These must be very clean going into the fielded environment or just the residue from the HASL process can set up corrosion cells. The plating process for the gold finish is not as difficult to clean and the residues are typically very low even with RO water rinsing.

If you would like to learn more details or you have any different opinions, please feel free to contact us and let us know at sales@bestfpc.com

Do you know the difference between ENIG and plating gold?

Before we point to the topic, I’d like to share one story with you first.

Recently, one of our customers, whose projects need ENIG(1u”) on whole surface, and we didn’t know these projects was strict with the gold surface on some special area. 

There are two pre-treatment for ENIG, one is gridding plating, another is sand blasting. At first, what we used is gridding plate, so when customer watched the gold surface can saw some cracks.

Gridding plate

To solve this issue, we suggested to try sand blasting ENIG pre-treatment. Compared with gridding plating, it only need slightly brush the plate. But it’s still cannot meet customer’s need.

Sand blasting

For normal design, change the surface treatment from ENIG(1u”) to gold plating can completely solve this issue. But in this design, the PADs on boards are separate, and there are in different gridding with outside. So gold plating is infeasible for this design.

Only when the inner PADs lie in same gridding with big copper plate, the gold plating is feasible.

So, let going to today’s the topic. What’s the difference between ENIG and plating gold?

  1. The difference in process.
  2. ENIG is called immersion gold, achieved by chemical deposit. Through an oxidation-reduction chemical reaction, it formed a layer of coating. It’s one of chemical nickel-gold depositing methods, can reach thicker gold layer.

It need pre-treatment gridding plating and sand blasting before immersion gold, need brush the board to enhance the adhesion between the board and the gold surface.

2)Gold plating use the principle of electrolysis, also known as electroplating. Needn’t pre-treatment before plating gold.

  • The difference in color.

ENIG is golden.

Plating gold will be slightly whiter (nickel color).

  • The difference in performance.

The crystal structure between ENIG and gold plating is different. Compared with plating gold, ENIG is easier to weld and will not cause bad welding.

The stress of ENIG is more easily controlled, for the products with bond, more conducive to the processing of the bond.


Last but not least, as we mentioned at the beginning, if your project need plating gold, pls make sure these area need gold plating can connect with outside gridding.

Hope above information is helpful for you to know more about ENIG and plating gold.

If any further question, pls let us know.

What should be paid attention to in the bending process of FPC?

Flexibility is the most obvious advantage for flex PCB, but we should maintain a degree during use, not just bend casually, so what should we pay attention to when bending?

  1. Although the FPC can be bent, if it is bent at 180°, this may cause damage to the copper traces, and it lead to open or short circuits.
  • Most of the ink-type protective layer is not resistant to bend, such as text/silk screen, marking, solder mask, etc. It is strictly prohibited to have more than 90° bending action in the assembly process.
  • The corners of the FPC outline, which are prone to tearing during the assembly process, reminding users to pay attention to it.
  • The exposed part of the FPC is subjected to surface plating treatment, such as gold/gold plating, etc., the focus is on preventing oxidation. This area is not suitable for bending.
  • Although there is a stiffener design in the golden finger plug-in area, it is still not suitable for bending in this area. Special attention should be paid to the assembly process.
  • Do not bend directly on the via area of FPC.

If you have any design question about bending area, please feel free to contact us at sales@bestfpc.com. We will share more details about increasing the bending times soon.

What is the differences between FFC and FPC?

Have you ever been heard about the FFC? Do you would like to learn about the FFC usually will be used in which kind of field? What are the differences between FPC and FPC?

FFC means flat flexible cable, it consists of multiple flat conductors insulated with a flexible plastic film that is laid out with conductors that are straight. It’s shape fixed as a rectangle. The pitches are available such as 0.5mm, 1.0mm and 1.25mm. Pitch means the distance between the center of conductor to the center of the conductor next to it.


What kind of FFCs usually used for PCB? It’s typically have a stiffener attached to the opposite side of the contact portion side to be inserted into a connector. They are simple one-to one connect jumpers. The FFCs are widely used in LCDS, mother boards, touch screens, cameras and other various devices.

FPC means flexible printed circuit board. FPC consist of copper, coverlay and PI. Can be customize as different patterns and multilayers flex pcb.


The mainly differences between the FFC and FPC?

1. Base material different: FFC base material is PET material, the range of use temperature from 85 to 165 °F. FPC base material is PI material. Attached the difference between PI and PET difference blog for your reference, hope you will be interested in . https://www.bestfpc.com/blog/2020/09/26/what-are-the-differences-between-the-poyester-pet-and-polymidepi-material%EF%BC%9F/

2. FFC width depends on the connector need to assembled pitch. FPC can be customized by all kinds of shapes. That is why the FFC you have seen is the rectangle shape, and there are all kinds of outline FPC.  

3. FFC is can be designed as 1 layer, but FPC can be designed as 1~10 layers.

4, FFC surface color usually is white, FPC is yellow, black or white.

If you have any query about FFC? Please feel free to contact Best Technology at sales@bestfpc.com

Did you heard of etch 6L FPC to be 2L FPC?

We received a special project, one of our customer need 2L FPC, and want the thickness between two copper layers to be 0.15mm. Because this customer is specialized in RF product, he need so thick dielectric(0.15mm) between two copper layers.

What does it means?

  1. Firstly, for adhesive material, it means “adhesive + Polyimide + adhesive” should meet 0.15mm. If Adhesive is 25um, two adhesive layer totally 50um, the minimum Polyimide thickness will be 4mil.
  2. Secondly, for 4mil Polyimide, it usually refers to adhesive-less material. So if deduct 50um adhesive, it require 6mil adhesiveless material. 6mil adhesiveless PI is very hard to purchase, need to customize, have MOQ limit, and lead time will be very long.

Is there any solution to meet customer’s need?

After discussed with our engineers and manufacture department, we put forward one suggestion. Draw an stack up with 6L FPC, it’s made up of three double-sided FPC. Etch out one copper layers in TOP and Bottom double-sided FPC. And for the middle double-sided FPC, we’ll etch out two copper layers, only leave Polyimide and adhesive. 

By doing this, it finally will only leave two copper layers, and the thickness between two copper layers is 0.15mm. (As below stack up show)

To be honest, when customer put forward to his design requirement, I was amazed, 0.15mm material is so hard to purchase. But our engineers and manufacture department find a good solution for our customer. Our customer are satisfied with our work.

If you have similar need, pls feel free to contact us. We can help you make it come ture.

How much do you know about FPC surface finish?

How many types of FPC surface treatment have you ever seen? FPC & Rigid flex is unlike Rigid FR4 PCB, there are less types of surface treatment in flexible PCB manufacturing, and most of flex pcb defult ENIG 1u’’ for flex pcb and rigid flex pcb. Please refer to the following FPC surface finishing:

  1. Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of flexible printed circuit boards (FPCs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes. It consists of an electroless nickel plating, covered with a thin layer of gold, which protects the nickel from oxidation. The gold is typically applied by quick immersion in a solution containing gold salts.

In generally, we will default as ENIG 1u’’ for customers if there are no any special requirements from our customer. There are also some special requirements from our customer, such the whole FPC surface area need to ENIG, it is very expensive. And there are also some customers may need hard gold plating (30~50u’’)for gold finger area.  


The advantages of Immersion gold( ENIG) will have very smooth surface, long storage time, easy for PCB soldering; suitable for fine pitch components and thin PCB board. It is more suitable for FPC just because of the thinner thickness.

2.Organic solderable protective layer (OSP) This process refers to cover the exposed bare PCB copper surface with a specific organic material.


Advantages: Can ensure a very flat surface, in line with environmental requirements. It’s cheaper compared with other surface finish.

Disadvantages: Once removed, the bare copper is exposed and subject to oxidation. Need to use conventional wave soldering and selective wave soldering process PCBA, does not allow the use of OSP surface treatment process. And it has a very limited shelf life.

2. ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) , ENEPIG is an acronym for Electroless Nickel Electroless Palladium Immersion Gold. This type of finish offers abundant benefits that make it suitable for a variety of applications.When we consider the final finish performance in a variety of different assembly methods, it can be seen that ENEPIG is suitable for a wide range of assembly requirements. The only one disadvantage of ENIPIG is the price is the most expensive.


In conlusion, we sumarized the OSP and ENIG and ENEPIG some characteristics as a form as below, please kindly check it. Sincerely hope it will be helpful for you. If you have any quetions or would like to learn more details, warmly welcome you to contact us at sales@bestfpc.com