Differences between Roll Anneal Copper Foil and Electrolysis Deposition Copper Foil

Differences between Roll Anneal Copper Foil and Electrolysis Deposition Copper Foil

Roll Anneal Copper Foil (RA copper):

Formation: Roll copper block many times, and then do the annealing treatment with high temperature. The shape of its crystal is lamellar structure.
Advantage: Soft, smooth surface, suitable for flexible PCB and small lines.
Shortage: high cost

Electrolysis Deposition Copper Foil (ED copper):

Formation: Melt copper into dilute sulfuric acid, it becomes bluestone solution.
Through a high electric field, copper attach on the metal drum. With the rolling of metal drum, thin copper foil finally formed.

Advantage: Low cost
Shortage: Unsuitable for small lines; bad bending resistance.
Here is the cross section observation of RA Copper and ED Copper:

roll anneal copper foil and electrolysis deposition copper foil

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2 thoughts on “Differences between Roll Anneal Copper Foil and Electrolysis Deposition Copper Foil

  1. Hi Peter
    may I use this Picture (comparison of crystal structure RA vs. ED Copper Foil in my Technical Paper which I will present at SMTAI this year? I will mention a link to your web page as the source of this picture.

    1. Hi Mustafa,

      Sorry for late reply. Just found your message from Spam folder.

      Yes, you can use it and I’m glad that picture is helpful for you.

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