Advances in surface mount technology, mounting devices directly on circuits, have led to exceptional space and cost savings. KAPTON's excellent thermal stability provides a better base for surface mounting than hard boards. Because the compliant base film places less stress on soldered joints, thermal mismatch is less likely to occur.
With conductive adhesives, surface mount chips can be mounted on double-sided flex circuits. This eliminates the problem of soldering one device on a hard board, then soldering again on the other side, disturbing the previous connection.
Tape automated bonding (TAB) is another space-saving technology for which flex is ideal. Because KAPTON film can be etched so accurately, windows can be placed on the flex circuit to hold devices. The devices can then he soldered into place with TAB.