The structure, technique and design of FPC (1)

As more and more clamshell phones come into market, the FPCs are more and more used.

 According to the combination ways of the base material and the copper, the FPCs can be divided into two kinds: adhesive FPC and adhesiveless FPC.

 The price of adhesiveless FPC is much higher than the adhesive FPC. However it is superior to FPC in the aspects of flexibility, boning force of copper and the base material, and the flatness of soldering pad. Therefore generally it only is used in the occasion of high demand, such as COF (chip on flex, to mount exposed chips on FPC has high requirement of the soldering pad flatness).

 Due to adhesiveless FPC’s high price, at present most of the FPCs applied at the market are adhesive.

 Because the FPC is mainly used at the occasion of bending, if the design or technique is not proper, defaults such as micro-crack, snap of the welding point will be easy to arise. I will introduce the structure of FPC and its special requirements on design and technique.