Solderability Test

Solderability testing has become more common in the industry particularly to assess components and printed board surface finishes during the transition to lead-free manufacture. The wetting balance is the standard method of test and provides the repeatability that other methods do not.

Test Principle: Put the samples into tin bath, detect the solderability according to the hole wetting degree.
Ttest Purpose: Test the solderability of the PCB samples
Test Instrument: Thermostatic tin stove

Procedure:
1. Setting the tin slot temperature at 245℃, turn on the power.
2.Waiting for the Test Procedure up to 245℃+/-5℃, paint the samples with rosin. Use clamps nip it , just do as wave-soldering,let samples contact with the tin slot surface. Depth is about 2mm, time is nearly 4 seconds.
3. Tin material changing times: once / two weeks
4.Comments: The plated holes permit only 10% with half infiltrating, nonwettable and air blow is not allowed.


Figure 1. PCB samples before testing with the wetting balance



Figure 2. PCB samples after testing with the wetting balance.

As assembly Electronic components to printed circuit board always need high quality Interchange connection technology, doing the solderability test has great help to the high quality and zero defects welding technology. Our Best Technology did Solderability Test for every batch PCB, but due to some objective reasons, we didn’t give customers the solderability test samples. If customers need it, can also contact us.

Earthquake in Japan

When news come in, no one can believe it. I think, is it a rumor? But few hours later, we have to accept the fact. 9.0 Earthquake really happened in Japan! It is one of bigger disaster recently happened in the world. Remember last time in China, the earthquake is only 8, but it has caused uncountable lost for us. We really hope this bad condition will be finished very soon.

Express our deep sympathy for Japanese and May God Bless them!