Today we will continue expanding some basic knowledge of PCB:
3. Components encapsulation technology
(1) Through hole technology
It means we mount components on one side, and solder the pins on the other. The disadvantage of it is space consuming. In fact, theirs pins take up space of both sides. While the advantage of it is good construction, which can bear pressure.
(2) Surface mounted technology
it means pins are soldered on the same side as components. We don’t have to drill holes on PCB and don’t have to solder every pin. The advantage of SMT is that the components are more compact and cheaper than those in THT.
4. Gerber files:
Usually it comprises the layout plan of signal, ground, power, solder mask, silk screen, and drilling layout plan, etc.
5. Manufacture steps
choose base material, then use subtractive transfer to show the artwork on metal conductor.
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