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We list out our usual material and technological specification of Flexible Circuits & flex printed circuits (FPC) at the belowing table. If you would like some specail material, tighter tolerance or other requirements, you can Contact our stuff directly, we are at your service at anytime.
Parameter (mm) |
Polyimide (PI) |
PET |
| Laminate Thickness |
0.025 / 0.050/ 0.125/ 0.175 |
0.025 / 0.050/ 0.075 |
| Copper Foil |
0.018,0.035,0.070 |
0.035,0.070 |
| Min Pattern width/Space |
0.075(3 mil) |
0.075(3 mil) |
| Min. Drilled Hole Size |
Non-Plated Thru |
0.25 ( .010" ); Tolerance +/-.0386( .0015") |
| Plated Thru |
0.25. ( .010" ); Tolerance +/-.076( .0030") |
| Outlines Dimension |
+/- 0.05 |
+/- 0.05 |
Peeling Strength(180°Direction) |
>1.2kgf / cm |
>1.2kgf / cm |
| Solder Hent Resistance |
280℃ / 10secs |
280℃ / 10secs |
| Surface Treatment |
Ni/Au |
2～5μm |
2～5μm |
| Au(Electro/Immersion) |
0.03 ~0.1μm |
0.03 ~0.1μm |
| Sn/Pb (Lead Free) |
3~ 20μm |
3~ 20μm |
| Sn-Cu Plating (Lead Free) |
3~ 5μm |
3~ 5μm |
| Tin Plating (Pure Sn) |
5 ~ 8μm |
5 ~ 8μm |
| Bending flexibility |
Meet to IPC Criterion |
| Chemical Resistance |
Meet to IPC Criterion |
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